Technical capabilities and processes

Technical equipment

Performance: 17, 500 comp./hour.
Setting accuracy: ± 0.04 mm @ 3 sigma.
Spacing chips, mm:
spacing — from 0.2 to 2.54 mm;
step beads — from 0.25 to 2.0 mm;
the diameter of the balls — from 0.1 to 0.63 mm.
Chip-size components: from 01005.
The dimensions of the working field, mm:
min — 50.0×30.0 mm;
max — 410.0×360.0 m.

Manufacturing process

1. Testing ПП
2. Soldering paste
3. 3D optical control AOI
4. Installing components
5. Incoming inspection and certification of components Components
6. Reflow
7. Optical control AOI
8. X-ray inspection AXI
9. Circuit test ICT
10. Combined testing ICT+FT

SMD-mounting portion

Plot surface mounting

Checks

Contract manufacturing of wiring harnesses