Technical capabilities and processes
Performance: 17, 500 comp./hour.
Setting accuracy: ± 0.04 mm @ 3 sigma.
Spacing chips, mm:
spacing — from 0.2 to 2.54 mm;
step beads — from 0.25 to 2.0 mm;
the diameter of the balls — from 0.1 to 0.63 mm.
Chip-size components: from 01005.
The dimensions of the working field, mm:
min — 50.0×30.0 mm;
max — 410.0×360.0 m.
- Testing ПП
- Soldering paste
- 3D optical control AOI
- Installing components
- Incoming inspection and certification of components Components
- Optical control AOI
- X-ray inspection AXI
- Circuit test ICT
- Combined testing ICT+FT
Plot surface mounting
Contract manufacturing of wiring harnesses